EM78P346N Datasheet, PDF (95/96 Pages) ELAN Microelectronics Corp – 8-Bit Microprocessor with OTP ROM

EM78P346N
8-Bit Microprocessor with OTP ROM
C Quality Assurance and Reliability
Test Category
Test Conditions
Solderability
Solder temperature=245±5°C, for 5 seconds up to the
stopper using a rosin-type flux
Step 1: TCT, 65°C (15mins)~150°C (15mins), 10 cycles
Step 2: Bake at 125°C, TD (endurance)=24 hrs
Step 3: Soak at 30°C/60%dTD (endurance)=192 hrs
Pre-condition
Step 4: IR flow 3 cycles
(Pkg thickness ≥ 2.5mm or
Pkg volume ≥ 350mm³ ----225±5°C)
(Pkg thickness ≤ 2.5mm or
Pkg volume ≤ 350mm³ ----240±5°C)
Temperature cycle test -65°C (15mins)~150°C (15mins), 200 cycles
Pressure cooker test
TA =121°C, RH=100%, pressure=2 atm,
TD (endurance)= 96 hrs
High temperature /
High humidity test
TA=85°C , RH=85%dTD (endurance) = 168 , 500 hrs
High-temperature
storage life
TA=150°C, TD (endurance) = 500, 1000 hrs
High-temperature
operating life
Latch-up
TA=125°C, VCC = Max. operating voltage,
TD (endurance) = 168, 500, 1000 hrs
TA=25°C, VCC = Max. operating voltage, 150mA/20V
ESD (HBM)
TA=25°C, ≥þ± 3KVþ
ESD (MM)
TA=25°C, ≥ þ± 300Vþ
Remarks
–
For SMD IC (such as
SOP, QFP, SOJ, etc)
–
–
–
–
–
–
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
VDD-VSS(+),VDD_VSS
(-) mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise-caused address error is detected, the MCU will repeat execution of the
program until the noise is eliminated. The MCU will then continue to execute the next
program.
Product Specification (V1.0) 12.25.2007
(This specification is subject to change without further notice)
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