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MC-4R128FKE8S Datasheet, PDF (9/14 Pages) Elpida Memory – Direct Rambus DRAM SO-RIMM Module 128M-BYTE (64M-WORD x 18-BIT)
MC-4R128FKE8S
AC Electrical Specifications
Symbol
Parameter and Conditions
MIN. TYP. MAX. Unit
Z
Module Impedance of RSL signals
25.2 28.0 30.8 Ω
Module Impedance of SCK and CMD signals
23.8 28.0 32.2
TPD
Average clock delay from finger to finger of all RSL clock nets
1.06 ns
(CTM, CTMN,CFM, and CFMN)
∆TPD
Propagation delay variation of RSL signals with respect to TPD Note1,2
-21
+21 ps
∆TPD-CMOS
Propagation delay variation of SCK signal with respect to an average clock
delay Note1
∆TPD- SCK,CMD Propagation delay variation of CMD signal with respect to SCK signal
-250
-200
+250 ps
+200 ps
Vα/VIN
Attenuation Limit
-845
12.0 %
VXF/VIN
Forward crosstalk coefficient
-845
2.0
%
VXB/VIN
Backward crosstalk coefficient
-845
1.5
%
RDC
DC Resistance Limit
-845
0.9
Ω
Notes 1. TPD or Average clock delay is defined as the average delay from finger to finger of all RSL clock nets (CTM,
CTMN, CFM, and CFMN).
2. If the SO-RIMM module meets the following specification, then it is compliant to the specification.
If the SO-RIMM module does not meet these specifications, then the specification can be adjusted by the
“Adjusted ∆TPD Specification” table.
Adjusted ∆TPD Specification
Symbol
Parameter and conditions
Adjusted MIN./MAX.
Absolute
Unit
MIN. MAX.
∆TPD Propagation delay variation of RSL signals with respect to TPD +/− [17+(18*N*∆Z0)] Note -30
+30
ps
Note N = Number of RDRAM devices installed on the SO-RIMM module.
∆Z0 = delta Z0% = (MAX. Z0 − MIN. Z0) / (MIN. Z0)
(MAX. Z0 and MIN. Z0 are obtained from the loaded (high impedance) impedance coupons of all RSL layers
on the module.)
Data Sheet E0139N30 (Ver. 3.0)
9