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EDX1032BBBG-3C-F Datasheet, PDF (28/85 Pages) Elpida Memory – 1G bits XDR DRAM
EDX1032BBBG
Read/Write Interaction
The previous section described overlapped read transactions
and overlapped write transactions in isolation. This section will
describe the interaction of read and write transactions and the
spacing required to avoid channel and core resource conflicts.
Figure 11 shows a timing diagram (top) for the first case, a
write transaction followed by a read transaction. Two COL
packets with WR commands are presented on cycles T0 and
T2. The write data packets are presented a time tCWD later on
cycles T4 and T6. The device requires a time tΔWR after the sec-
ond COL packet with a WR command before a COL packet
with a RD command may be presented. Two COL packets
with RD commands are presented on cycles T11 and T13. The
read data packets are returned a time tCAC later on cycles T17
and T19. The time tΔWR is required for turning around internal
bidirectional interconnections (inside the device). This time
must be observed regardless of whether the write and read
commands are directed to the same bank or different banks. A
gap tWR-BUB,XDRDRAM will appear on the DQ bus between the
end of the D(a2) packet and the beginning of the Q(b1) packet
(measured at the appropriate packet reference points). The size
of this gap can be evaluated by calculating the difference
between cycles T2 and T17 using the two timing paths:
tWR-BUB,XDRDRAM ≤ tΔWR + tCAC - tCWD - tCC
In this example, the value of tWR-BUB,XDRDRAM is greater than
its minimum value of tWR-BUB,XDRDRAM,MIN. The values of
tΔRW and tCAC are equal to their minimum values.
In the second case, the timing diagram displayed at the bottom
of Figure 11 illustrates a read transaction followed by a write
transaction. Two COL packets with RD commands are pre-
sented on cycles T0 and T2. The read data packets are returned
a time tCAC later on cycles T6 and T8. The device requires a
time tΔRW after the second COL packet with a RD command
before a COL packet with a WR command may be presented.
Two COL packets with WR commands are presented on cycles
T10 and T12. The write data packets are presented a time tCWD
later on cycles T13 and T15. The time tΔRW is required for turn-
ing around the external DQ bidirectional interconnections
(outside the device). This time must be observed regardless
whether the read and write commands are directed to the same
bank or different banks. The time tΔRW depends upon four
timing parameters, and may be evaluated by calculating the dif-
ference between cycles T2 and T13 using the two timing paths:
tΔRW + tCWD = tCAC + tCC + tRW-BUB,XDRDRAM
or
tΔRW = (tCAC - tCWD)+ tCC + tRW-BUB,XDRDRAM
In this example, the values of tΔRW, tCAC, tCWD, tCC, and tRW-
BUB,XDRDRAM are equal to their minimum values.
Propagation Delay
Figure 12 shows two timing diagrams that display the system-
level timing relationships between the memory component and
the memory controller.
The timing diagram at the top of the figure shows the case of a
write-read-write command and data at the memory compo-
nent. In this case, the timing will be identical to what has
already been shown in the previous sections; i.e. with all timing
measured at the pins of the memory component. This timing
diagram was produced by merging portions of the top and bot-
tom timing diagrams in Figure 11.
The example shown is that of a single COL packet with a write
command, followed by a single COL packet with a read com-
mand, followed by a second COL packet with a write com-
mand. These accesses all assume a page-hit to an open bank.
A timing interval tΔWR is required between the first WR com-
mand and the RD command, and a timing interval tΔRW is
required between the RD command and the second WR com-
mand. There is a write data delay tCWD between each WR com-
mand and the associated write data packet D. There is a read
data delay tCAC between the RD command and the associated
read data packet Q. In this example, all timing parameters have
assumed their minimum values except tWR-BUB,XDRDRAM.
The lower timing diagram in the figure shows the case where
timing skew is present between the memory controller and the
memory component. This skew is the result of the propagation
delay of signal wavefronts on the wires carrying the signals.
The example in the lower diagram assumes that there is a prop-
agation delay of tPD-RQ along both the RQ wires and the
CFM/CFMN clock wires between the memory controller and
the memory component (the value of tPD-RQ used here is
1*tCYCLE). Note that in an actual system the tPD-RQ value will
be different for each memory component connected to the RQ
wires.
In addition, it is assumed that there is a propagation delay tPD-
D along the DQ/DQN wires between the memory controller
and the memory component (the direction in which write data
travels, and it is assumed that there is the same propagation
delay tPD-Q along the DQ/DQN wires between the memory
component and the memory controller (the direction in which
read data travels). The sum of these two propagation delays is
also denoted by the timing parameter tPD,CYC = tPD-D+tPD-Q.
Data Sheet E1819E20 (Ver. 2.0)
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