BYD67A Datasheet, PDF (2/2 Pages) EIC discrete Semiconductors – RIPPLE BOCKING DIODE

TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
RATING AND CHARACTERISTIC CURVES ( BYD67A )
FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
2.0
1.6
1.2
FIG.2 - MAXIMUM STEADY STATE POWER DISSIPATION
AS A FUNCTION OF AVERAGE FORWARD CURRENT
5
4
a =3 2.5 2 ^1.57
1.42
3
0.8
2
0.4
0
0
40
80
120
160
200
TIE-POINT TEMPERATURE, Ttp ( °C)
FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE
0.6
0.4
0.2
1
a = I_F(RMS)/I_F(AV) ; V_R = V_RRMmax ; δ = 0.5
0
0
0.4
0.8
1.2
1.6
2.0
AVERAGE FORWARD CURRENT, I_F(AV) (A)
FIG.4 - FORWARD CURRENT AS FUNCTION
OF FORWARD VOLTAGE
6
5
T_J = 25 °C
4
3
2
0
0
40
80
120
160
200
AMBIENT TEMPERATURE, Ta ( °C)
FIG.5 - REVERSE CURRENT AS FUNCTION OF
JUNCTION TEMPERATURE; MAXIMUM VALUES
1000
V_R =V_RRMmax
1
0
0
1
2
3
4
5
FORWARD VOLTAGE, V_F (V)
100
10
1
0
100
200
JUNCTION TEMPERATURE, T_J ( °C)
Page 2 of 2
Rev. 00 : February 13, 2008