LMR1A Datasheet, PDF (1/2 Pages) EIC discrete Semiconductors – GLASS PASSIVATED JUNCTION

TH97/2478
TH09/2479
IATF 0060636
SGS TH07/1033
LMR1A - LMR1M
GLASS PASSIVATED JUNCTION
FAST RECOVERY RECTIFIERS
PRV : 50 - 1000 Volts
M1A
Io : 1.0 Ampere
FEATURES :
* Glass passivated junction chip
* High surge current capability
* High reliability
* Low reverse current
* Low forward voltage drop
* Fast switching for high efficiency
* Pb / RoHS Free
0.085(2.16)
0.075(1.91)
1.00 (25.4)
MIN.
0.138(3.51)
0.122(3.10)
MECHANICAL DATA :
* Case : M1A Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Lead : Axial lead solderable per MIL-STD-202,
Method 208 guaranteed
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.20 gram (approximately)
0.024(0.60)
0.022(0.55)
1.00 (25.4)
MIN.
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RATING
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current
0.375"(9.5mm) Lead Length
Peak Forward Surge Current,
Ta = 55 °C
8.3ms Single half sine wave Superimposed
on rated load (JEDEC Method)
Maximum Peak Forward Voltage at IF = 1.0 Amp.
Maximum DC Reverse Current
Ta = 25 °C
at Rated DC Blocking Voltage
Ta = 100 °C
Maximum Reverse Recovery Time ( Note 1 )
Typical Junction Capacitance ( Note 2 )
Junction Temperature Range
Storage Temperature Range
SYMBOL LMR1A LMR1B LMR1D LMR1G LMR1J LMR1K LMR1M
V_RRM
V_RMS
V_DC
50 100 200 400 600 800 1000
35
70 140 280 420 560 700
50 100 200 400 600 800 1000
UNIT
V
V
V
I_F(AV)
1.0
A
I_FSM
V_F
I_R
I_R(H)
Trr
C_J
T_J
T_STG
25
A
1.4
V
5
µA
50
µA
150
250
500
ns
50
pF
- 65 to + 150
°C
- 65 to + 150
°C
Notes :
( 1 ) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
( 2 ) Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC
Page 1 of 2
Rev. 02 : April 28, 2009