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BYD37D Datasheet, PDF (1/2 Pages) EIC discrete Semiconductors – AVALANCHE FAST SOFT-RECOVERY RECTIFIER DIODES
Certificate TH97/10561QM
Certificate TW00/17276EM
BYD37D - BYD37M
AVALANCHE FAST SOFT-RECOVERY
RECTIFIER DIODES
PRV : 200 - 1000 Volts
Io : 1.5 Amperes
FEATURES :
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy
absorption capability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
MECHANICAL DATA :
* Case : Molded plastic
* Terminals : Plated Terminals, solderable per
MIL-STD-750 Method 2026
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.116 gram
MELF (Plastic)
Cathode Mark
φ 0.102 (2.6)
0.094 (2.4)
0.205(5.2)
0.189(4.8)
0.022(0.55)
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage @ IR = 0.1 mA
Maximum Average Forward Current Ttp = 105 °C (Note 1)
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)
Maximum Repetitive Peak Forward Current
Maximum Forward Voltage at 1.0 A
Maximum Reverse Current at VR =VRRMmax
TJ = 20 °C
TJ = 165 °C
Maximum Reverse Recovery Time (Note 3)
SYMBOL
VRRM
VR
V(BR)R-min
IF(AV)
IFSM
IFRM
VF
IR
IR(H)
Trr
BYD
37D
200
200
300
BYD
37G
400
400
500
250
BYD
37J
600
600
700
1.5
20
12
1.3
1.0
100
BYD BYD UNIT
37K 37M
800 1000 V
800 1000 V
900 1100 V
A
A
A
V
μA
μA
300
ns
Thermal Resistance from Junction to Tie-Point
Rth j-tp
30
K/W
Thermal Resistance from Junction to Ambient (Note 4)
Rth j-a
120
K/W
Junction Temperature Range
Storage Temperature Range
TJ
TSTG
- 65 to + 175
°C
- 65 to + 175
°C
Notes :
(1) Averaged over any 20 ms period.
(2) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax
(3) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-lay≤ 40 μm.
Page 1 of 2
Rev. 02 : March 9, 2006
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