BYD17DA Datasheet, PDF (1/2 Pages) EIC discrete Semiconductors – GENERAL PURPOSE CONTROLLED AVALANCHE RECTIFIERS

TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
BYD17DA - BYD17MA
GENERAL PURPOSE CONTROLLED
AVALANCHE RECTIFIERS
PRV : 200 - 1000 Volts
Io : 1.5 Amperes
FEATURES :
* Glass passivated junction chip
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
MECHANICAL DATA :
* Case : SMA Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Lead : Lead Formed for Surface Mount
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.067 gram
SMA (DO-214AC)
1.1 ± 0.3
1.2 ± 0.2
2.6 ± 0.15
2.1 ± 0.2
0.2 ± 0.07
2.0 ± 0.2
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (Tj = 25 °C unless otherwise specified.)
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum Crest Working Reverse Voltage
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage at I_R = 0.1 mA
Maximum Average Forward Current Ttp = 105 °C
(Note 1)
Ta = 65 °C; PCB mounting
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)
Maximum Forward Voltage
Maximum Reverse Current
at I_F = 1 A , Tj = 25 °C
at I_F = 1 A , Tj = 175 °C
at V_R = V_RRMmax , Tj = 25 °C
at V_R = V_RRMmax , Tj = 165 °C
Typical Reverse Recovery Time (Note 3)
Thermal Resistance from Junction to Tie-Point
Thermal Resistance from Junction to Ambient (Note 4)
Operating Junction Temperature Range
Storage Temperature Range
SYMBOL
V_RRM
V_RWM
V_R
V_(BR)R-min
I_F(AV)
I_FSM
V_F
I_R
I_R(H)
Trr
Rth j-tp
Rth j-a
T_J
T_STG
BYD
17DA
200
200
200
225
BYD BYD BYD
17GA 17JA 17KA
400 600 800
400 600 800
400 600 800
450 650 900
1.5
0.6
20
1.05
0.93
1.0
100
3
30
150
- 65 to + 175
- 65 to + 175
BYD
17MA
1000
1000
1000
1100
UNIT
V
V
V
V
A
A
V
μA
μA
μs
K/W
K/W
°C
°C
Notes :
(1) Averaged over any 20 ms period.
(2) t = 10ms half sine wave; Tj = Tjmax prior to surge; V_R = V_RRMmax
(3) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥ 40 μm.
Page 1 of 2
Rev. 00 : February 13, 2008