1N5624 Datasheet, PDF (1/2 Pages) Powerex Power Semiconductors – Lead Mounted Rectifier

Certificate TH97/10561QM
Certificate TW00/17276EM
1N5624 - 1N5627
PRV : 200 - 800 Volts
Io : 3.0 Amperes
GLASS PASSIVATED JUNCTION
SILICON RECTIFIERS
D2A
FEATURES :
* Glass passivated cavity-free junction
* Low forward voltage drop
* High reliability
* Low reverse current
* High forward surge capability
* Pb / RoHS Free
0.161 (4.1)
0.154 (3.9)
1.00 (25.4)
MIN.
0.284 (7.2)
0.268 (6.8)
MECHANICAL DATA :
* Case : D2A Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Lead : Axial lead solderable per MIL-STD-202,
Method 208 guaranteed
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.645 gram
0.0400 (1.02)
0.0385 (0.98)
1.00 (25.4)
MIN.
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specified.
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current
0.375"(9.5mm) Lead Length Ta = 70 °C
Peak Forward Surge Current, 8.3ms Single half
sine wave Superimposed on rated load (JEDEC Method)
Maximum Forward Voltage
Maximum DC Reverse Current
at I_F = 3.0 A , Ta = 25 °C
at I_F = 3.0 A , Ta = 175 °C
Ta = 25 °C
at rated DC Blocking Voltage
Ta = 175 °C
Maximum Full Load Reverse Current, Full Cycle Average
0.375"(9.5mm) Lead Length at Ta = 70 °C
Typical Junction Capacitance (Note1)
Typical Thermal Resistance (Note2)
Junction Temperature Range
Storage Temperature Range
SYMBOL
V_RRM
V_RMS
V_DC
1N5624
200
140
200
1N5625
400
280
400
1N5626
600
420
600
1N5627
800
560
800
I_F(AV)
3.0
UNIT
V
V
V
A
I_FSM
V_F
I_R
I_R(H)
I_R(AV)
C_J
R_Ó¨JA
R_Ó¨JL
T_J
T_STG
125
1.00
0.95
5.0
300
200
150
100
40
20
10
- 65 to + 175
- 65 to + 175
A
V
µA
µA
µA
pF
°C/W
°C/W
°C
°C
Notes :
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length,
with both leads attached between heat sinks
Page 1 of 2
Rev. 02 : July 19, 2006