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GP1200FSM18 Datasheet, PDF (4/9 Pages) Dynex Semiconductor – Hi-Reliability Single Switch IGBT Module
GP1200FSM18
ELECTRICAL CHARACTERISTICS
T = 25˚C unless stated otherwise
case
Symbol
Parameter
td(off)
tf
E
OFF
td(on)
tr
EON
Q
rr
Irr
EREC
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
Tcase = 125˚C unless stated otherwise
Symbol
Parameter
td(off)
tf
EOFF
t
d(on)
tr
EON
Qrr
I
rr
EREC
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
Test Conditions
I = 1200A
C
VGE = ±15V
VCE = 900V
RG(ON) = RG(OFF) = 2.2Ω
L ~ 50nH
IF = 1200A, VR = 50% VCES,
dIF/dt = 4500A/µs
Min. Typ. Max. Units
-
1050 1250 ns
-
130 200 ns
-
550 700 mJ
-
300 400 ns
-
250 400 ns
-
450 650 mJ
-
250 350 µC
-
500
-
A
-
180
-
mJ
Test Conditions
IC = 1200A
V
GE
=
±15V
VCE = 900V
RG(ON) = RG(OFF) = 2.2Ω
L ~ 50nH
IF = 1200A, VR = 50% VCES,
dIF/dt = 4000A/µs
Min. Typ. Max. Units
-
1150 1350 ns
-
150 300 ns
-
650 850 mJ
-
400 550 ns
-
300 450 ns
-
650 800 mJ
-
425 550 µC
-
600
-
A
-
250
-
mJ
4/9
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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