MP03XXX175 Datasheet, PDF (3/10 Pages) Dynex Semiconductor – Phase Control Dual SCR, SCR/Diode Modules

MP03XXX 175 Series
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
V_GT
I_GT
V_GD
V
FGM
V
FGN
V_RGM
I_FGM
P
GM
P_G(AV)
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Conditions
V = 5V, T = 25^oC
DRM
case
V = 5V, T = 25^oC
DRM
case
V_DRM= 5V, T_case = 25^oC
Anode positive with respect to cathode
Typ. Max. Units
- 3.0 V
- 150 mA
- 0.25 V
-
30
V
Anode negative with respect to cathode - 0.25 V
- 5.0 V
Anode positive with respect to cathode
-
10 A
t
p
=
25µs
- 100 W
-
5
W
ORDERING INSTRUCTIONS
Part number is made up as follows:
Examples:
MP03 HBT 175 - 12
MP
03
HBT
175
12
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at T = 75^oC
case
= V_RRM/100
MP03 HBP175-12
MP03 HBN175-16
MP03 HBT175-10
NOTE: Diode ratings and characteristics are comparable with the SCR in types HBP or HBN.
Types HBP and HBN can also be supplied with diode polarity reversed, to special order.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base temperature
at 75^oC if full rated current is to be achieved. Power dissipation
may be calculated by use of V_T(TO) and r_T information in accordance
with standard formulae. We can provide assistance with
calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish of
N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
After application of thermal compound, place the module squarely
over the mounting holes, (or 'T' slots) in the heatsink. Using a
torque wrench, slowly tighten the recommended fixing bolts at
each end, rotating each in turn no more than 1/4 of a revolution at
a time. Continue until the required torque of 5Nm (44lb.ins) is
reached at both ends.
It is not acceptable to fully tighten one fixing bolt before starting to
tighten the others. Such action may DAMAGE the module.
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