GP800FSM18 Datasheet, PDF (2/10 Pages) Dynex Semiconductor – Hi-Reliability Single Switch IGBT Module

GP800FSM18
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
T_case = 25˚C unless stated otherwise
Symbol
Parameter
Test Conditions
V
CES
V
GES
I_C
I_C(PK)
P
max
V
isol
Collector-emitter voltage
V_GE = 0V
Gate-emitter voltage
-
Continuous collector current
T_case = 65˚C
Peak collector current
1ms, T_case = 100˚C
Max. transistor power dissipation T_case = 25˚C, T_j = 150˚C
Isolation voltage
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Max. Units
1800 V
±20
V
800 A
1600 A
6940 W
4000 V
THERMAL AND MECHANICAL RATINGS
Symbol
Parameter
Test Conditions
R
th(j-c)
Thermal resistance - transistor
Continuous dissipation -
junction to case
R
th(j-c)
Thermal resistance - diode
Continuous dissipation -
junction to case
R
th(c-h)
Thermal resistance - case to heatsink (per module) Mounting torque 5Nm
(with mounting grease)
T
Junction temperature
j
Transistor
Diode
T_stg
Storage temperature range
-
Screw torque
-
Mounting - M6
Electrical connections - M4
Electrical connections - M8
Min. Max. Units
-
18 ˚C/kW
-
40 ˚C/kW
-
8 ˚C/kW
-
150 ˚C
-
125 ˚C
–40 125 ˚C
-
5
Nm
-
2
Nm
-
10 Nm
2/10
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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