DIM400NSM33-F000_15 Datasheet, PDF (1/8 Pages) Dynex Semiconductor – Single Switch IGBT Module

Replaces DS5883-3
DIM400NSM33-F000
Single Switch IGBT Module
DS5883-4 October 2011 (LN28811)
FEATURES
 10µs Short Circuit Withstand
 High Thermal Cycling Capability
 Soft Punch Through Silicon
 Isolated AlSiC Base with AlN Substrates
 Lead Free Construction
APPLICATIONS
 High Reliability Inverters
 Motor Controllers
 Traction Drives
 Choppers
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM400NSM33-F000 is a single switch 3300V,
soft punch through n-channel enhancement mode,
insulated gate bipolar transistor (IGBT) module. The
IGBT has a wide reverse bias safe operating area
(RBSOA) plus 10μs short circuit withstand. This
device is optimised for traction drives and other
applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety.
KEY PARAMETERS
V_CES
V_CE(sat) * (typ)
I_C
(max)
I_C(PK) (max)
3300V
2.8V
400A
800A
* Measured at the auxiliary terminals
4(C)
2(C)
C
G
E
3(E)
1(E)
Fig. 1 Circuit configuration
ORDERING INFORMATION
Order As:
DIM400NSM33-F000
Note: When ordering, please use the complete part
number
Outline type code: N
(See Fig. 11 for further information)
Fig. 2 Package
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
1/8
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