AN4505 Datasheet, PDF (1/5 Pages) Dynex Semiconductor – Power Assemblies

Heatsinks
HEATSINKS
Power Assemblies
DS5404-1.0 November 2000
The current range of heatsinks is illustrated with a brief
resumé of their characteristics. The products available are
intended for use with all our power semiconductors - from
the small stud base through to large disc devices and
modules.
All heatsinks are suitable for Natural Air Cooling (AN) and
Forced Air Cooling (FC). In addition to a vast experience of
AN and FC cooling methods we also have many years
experience in liquid and phase change cooling.
A range of coolers for 17mm to 100mm silicon diameter
devices is available, as is a range of associated clamps.
AIR COOLED HEATSINKS
All dimensions shown in mm unless stated otherwise.
0.5
0.48
0.46
0.44
0.42
0.4
0.38
0.36
0.34
200W
0.32
0.3
125 175 225 275 325 375
HEATSINK LENGTH (mm)
Air natural
0.15
0.145
0.14
0.135
0.13
0.125
200W
0.12
125 165 205 245 285
HEATSINK LENGTH (mm)
Forced air (5m/s)
0.44
0.1
0.42
0.4
0.38
0.095
0.09
0.36
0.34
0.32
200 W
0.3
125 175 225 275 325 375
HEATSINK LENGTH (mm)
Air natural
0.085
0.08
200W
0.075
125 175 225 275 325 375
HEATSINK LENGTH (mm)
Forced air (5m/s)
27
M8 slots
175
Cross sectional area (cm²): 52.3
Weight kg/m: 141.2
Heatsink profile: ED
222 ± 1
M6 slot
50
Cross sectional area (cm²): 124.08
Weight kg/m: 31
Heatsink profile: EM
1/5
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