RMB1F_17 Datasheet, PDF (1/3 Pages) DIYI Electronic Technology Co., Ltd. – PHASE 0.8AMP FAST GLASS PASSIVATED BRIDGE RECTIFIER

RMB1F THRU RMB10F
SINGLE PHASE 0.8AMP FAST GLASS PASSIVATED BRIDGE RECTIFIER
Features
· ^{Glass Passivated Die Construction}
· ^{Low leakage}
· Ideal for printed circuit board
Surge overload rating-30A peak
· Designed for Surface Mount Application
· Plastic Material-UL Flammability 94V-0
-₊
Mechanical Data
· Case: MB-F, molded plastic
· Terminals: plated leads solderable per
MIL-STD-202, Method 208
· Polarity: as marked on case
· Mounting position: Any
· Marking: type number
· Lead Free: For RoHS / Lead Free Version,
MAX.
dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25℃ ambient temperature unless otherwise specified.
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
TYPE NUMBER
SYMBOL RMB1F RMB2F RMB4F RMB6F RMB8F RMB10F UNITS
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
V RRM
VRW M
VDC
VRMS
100 200 400 600 800 1000
V
70 140 280 420 560 700
V
Average Rectified Output Current (Note 1)@TC=100℃
(Note 2)@TC=100℃
IF(AV)
0.5
0.8
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
IFSM
30
A
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
I²t
Forward Voltage per element @IF=1.0A
VFM
Peak Reverse Current
@TA=25℃
At Rated DC Blocking Voltage @TA=125℃
IR
Maximum reverse recovery time (Note 3)
TRR
Typical Junction Capacitance per leg (Note4)
CJ
Typical Thermal Resistance per leg
RθJA
RθJL
Operating and Storage Temperature Range
TJ,TSTG
Note:1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
4. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
version:02
1 of 3
3.735
1.3
5.0
200
150
250
500
13
60
16
-55to+150
A²s
V
uA
ns
pF
℃/W
℃
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