KMB32S Datasheet, PDF (1/2 Pages) DIYI Electronic Technology Co., Ltd. – Low Power Loss,High Efficiency

Features
KMB32S THRU KMB325S
SINGLE PHASE 3.0AMP SURFACE MOUNTSCHOTTKY BRIDGE RECTIFIER
· ^{Schottky Brrier Chip}
· Low Power Loss,High Efficiency
MBS
· Ideally Suited for Automatic Assembly
· ^{Surge Overload Rating to 80A Peak}
· _{Plastic Case Material has UL Flammability}



C

la
s
s
if
ic
a

ti
o
n
R

a
ti
n
g

9
4
V
-
0


























Mechanical Data
· Case: MB-S, molded plastic
· Terminals: plated leads solderable per
0.028(0.7)
0.020(0.5)
צ㾦
e
0.195(4.95)
0.177(4.5)
0.106(2.7)
0.090(2.3)
MIL-STD-202, Method 208
· Polarity: as marked on case
· Mounting position: Any
· Marking: type number
0.043(1.1)
0.023(0.6)
· Lead Free: For RoHS / Lead Free Version,
0.161(4.1)
0.142(3.6)
0.067(1.7)
dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics @T_A=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
TYPE NUMBER
Peak Repetitive Reverse Voltage
RMS Reverse Voltage
DC Blocking Voltage
SYMBOL
KMB
32S
KMB
33S
KMB KMB
34S 345S
KMB
35S
KMB
36S
KMB
38S
KMB
310S
KMB
315S
KMB
320S
KMB
325S ^UNITS
VRRM 20 30 40 45 ^{50 60 80} 100 150 200 250
VR(RMS) 14 21 _{28 31} 35 42 56 ₇₀ 105 140 175 V
VDC 20 30 40 45 50 60 80 100 150 200 250
Average Rectified Output Current ( Note1) @T_A = 90°C
IO
3.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@I_F =3.0A
@T_A = 25°C
@T_A = 100°C
Typical Junction Capacitance per leg
IFSM
I²t
VFM
IRM
Cj
0.55
0.1
10
80
A
26.560
0.7
28
0.85
0.90
0.05
5
A²s
0.92 _V
mA
pF
Typical Thermal Resistance per leg ( Note2)
Operating junction temperature range
Operating and Storage Temperature Range
R
JA
TJ
TSTG
75
-55 to +150
-55 to +150
°C/W
°C
°C
Note:
1. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
2. Thermal REsistance From Junction to Ambient
version:01
1 of 2
www.dyelec.com