EMB1F Datasheet, PDF (1/2 Pages) DIYI Electronic Technology Co., Ltd. – SINGLE PHASE 0. AMP SUPER FAST GLASS PASSIVATED BRIDGE RECTIFI 8 ER

EMB1F THRU EMB6F
SINGLE PHASE 0.8AMP SUPER FAST GLASS PASSIVATED BRIDGE RECTIFIER
Features
· Glass passivated die construction
· Low forward voltage drop
· High current capability
· High surge current capability
· Designed for surface mount application
· Plastic material-UL flammability 94V-0
Mechanical Data
· Case: MB-F, molded plastic
· Terminals: plated leads solderable per
MIL-STD-202, Method 208
· Polarity: as marked on case
· Mounting position: Any
· Marking: type number
· Lead Free: For RoHS / Lead Free Version,
dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25℃ ambient temperature unless otherwise specified.
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
TYPE NUMBER
SYMBOL EMB1F
EMB2F
EMB3F EMB4F EMB6F UNITS
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V RRM
VRW M
100
200
VDC
RMS Reverse Voltage
VRMS
70
140
Average Rectified Output Current (Note 1)@TA=40℃
IO
(Note 2)@TA=40℃
300
400
210
280
0.5
0.8
600
V
420
V
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
IFSM
30
A
(JEDEC Method)
Forward Voltage per element @IF=0.8A
Peak Reverse Current
@TA =25 ℃
At Rated DC Blocking Voltage @TA =125℃
Maximum reverse recovery time (Note 3)
Typical Junction Capacitance per leg (Note4)
Typical Thermal Resistance per leg
Operating and Storage Temperature Range
VFM
IR
TRR
CJ
RθJA
RθJL
TJ,TSTG
0.95
1.25
5.0
500
35
25
60
16
-55to+150
1.7 V
uA
nS
pF
℃/W
℃
Note:1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
4. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
version:01
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