DS Datasheet, PDF (9/9 Pages) Panasonic Battery Group – DS RELAYS

SURFACE MOUNT
CERAMIC SMD MULTI-LAYER HIGH CAPACITANCE DS
TAPE DIMENSIONS (mm)
Type P Type C
D₀
A₀
B₀
t
t
K₁
P
P₂
E
F
W
G
P₀
directional of unreeling
W
Type
8.0 ± 0.3
C
8.0 ± 0.3
P
12.0 ± 0.3
P
C = Card P = Plastic
D0
1.5 +0.1, -0
1.5 +0.1, -0
1.5 +0.1, -0
P
4.0 ± 0.1
4.0 ± 0.1
8.0 ± 0.1
REEL DIMENSIONS (mm)
P0
4.0 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
P2
2.0 ± -0.05
2.0 ± 0.05
2.0 ± 0.05
E
1.75 ± 0.1
1.75 ± 0.1
1.75 ± 0.1
F
3.5 ± 0.05
3.5 ± 0.05
5.5 ± 0.05
G
0.75 min
0.75 min
0.75 min
t
1.1 max
0.3 max
0.1 max
Nom. Tape Width
8
12
A
180 or 330 +0-2
180 or 330 +0-2
W1
8.4 +1.5-0
12.4 +2-0
12.75
+0.15
-0
2 ± 0.5
20.5
+0.5
-0
62
± 1.5
A
W₁
PERFORMANCE CHARACTERISTICS
PERFROMANCE CHARACTERISTICS
1. ELECTRICAL
Dielectric Code
X7R
X5R
Y5V
Z5U
General
X7R dielectrics offer higher X5R dielectrics offer higher Y5V dielectrics offer the Z5U dielectrics offer the
capacitance for a given capacitance for a given highest capacitance for highest cpacitance for a
case size than COG.
case size than X7R.
a given case size than X5R. given case size than Y5V.
Examples of Applications
Applications would include
bypass, coupling and filter-
ing circuits.
Applictaions would include
bypass, coupling and filter-
ing circuits.
Applications would include
bypass and decoupling
circuits or where tempera-
ture dependence is not of
major importance.
Applications would include
bypass and decoupling
circuits or where tempera-
ture dependance is not of
major importance.
Temperature Range
-55° to + 125°
- 55° to + 85°
- 25° to + 85°
- 25° to + 85°
Insulation Resistance (I.R.) >100G ohms or 1000 sec >100G ohms or 1000sec
after 1 min charging at
whichever is less
whichever is less.
Rated Voltage
>10G ohms or 100 sec
whichever is less.
>10G ohms or 100 sec
whichever is less.
Voltage Ratings dc
10, 16, 25, 50
10,16,25
10, 16, 25, 35
10, 16, 25, 35
Proof Voltage
2.5 x rated voltage
2.5 X rated voltage.
2 x rated voltage
2.5 x rated voltage
Max allowable Capaci-
tance
Variation over Temperature
Range
± 15%
± 15%
+30% to - 80%
+22% to - 56%
2. ENVIRONMENT
Test
Resistance to soldering heat
Adhesion
Rapid change or Temperature
Conditions
Requirement
Components completely immersed in a solder 25% Max leaching on each edge
bath at 260 ± 10° for 5 secs.
Component mounted to substrate a force of No visible damage
5N applied normal to the line joining the termi-
nation and in a line parallel to the substrate.
- 55 to 125°C, 5 cycles (1B, 2C1)
- 25 to +85°, 5 cycles (2F4)
No visible damage. After recovery
∆ C/C
≤±1% or pF COG
∆ C/C
≤±10%
X7R
∆ C/C
≤±10%
X5R
∆ C/C
≤±20%
Y5V
Tan
≤1.5 x specified value
IR.
≤0.25 x specified value
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