SUF4001 Datasheet, PDF (1/2 Pages) Diotec Semiconductor – Ultrafast Switching Surface Mount Si-Rectifiers

Diode Semiconductor Korea _{SUF4001 --- SUF4007}
SURFACE MOUNT RECTIFIERS
FEATURES
Glass passivated device
Ideal for surface mouted applications
Low leakage current
Metallurgically bonded construction
MECHANICAL DATA
Case:JEDEC DO-213AB,molded plastic over
passivated chip
Terminals:Solder Plated, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Weight: 0.0046 ounces, 0.116 gram
Mounting position: Any
REVERSE VOLTAGE: 50 - 1000 V
CURRENT: 1.0 A
DO - 213AB
SOLDERABLE ENDS
D2=D1
Đ0
Ē0.20
D2
0.5± 0.1
4.9± 0.2
0.5± 0.1
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase,half wave,60Hz,resistive or inductive load.For capactive load,derate current by 20%.
SUF SUF SUF SUF SUF
4001 4002 4003 4004 4005
Maximum recurrent peak reverse voltage V_RRM 50
100
200
400
600
Maximum RMS voltage
V_RMS 35
70
140 280 420
Maximum DC blocking voltage
V_DC 50 100 200 400 600
Maximum average forword
rectified current T_A=50
I_(AV)
1.0
Peak forward surge current 8.3ms single
half-sine-wave superimposed
I_FSM
30
on rated load (JEDEC method)
Maximum forward voltage at 1.0A
V_F
Maximum DC reverse current @T_j=25
at rated DC blockjing voltage @T_j=100
I_R
1.0
10
50
Maximum reverse recovery time (Note1)
Typical thermal resistance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating temperature range
Storage temperature range
t_rr
R_{θJ T}
R_{θJ A}
T_j
T_STG
50
10
45
- 55 --- + 175
- 55 --- + 175
NOTES:1. Measured with I_F=0.5A, I_R=1A, I_rr=0.25A.
2. Thermal resistance junction to terminal, 6.0 mm ² coppeer pads to each terminal.
3. Thermal resistance junction to ambient, 6.0 mm ² coppeer pads to each terminal.
SUF
4006
800
560
800
1.7
75
SUF
UNITS
4007
1000 V
700
V
1000 V
A
A
V
µA
ns
K/W
K/W
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