GLZ2 Datasheet, PDF (1/4 Pages) Diotech Company. – 500mW SUFACE MOUNT ZENER DIODE

GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 98.5% Sn above
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
MINI-MELF / LL-34
0.063(1.6)
0.055(1.4) ^DIA.
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.020(0.5)
0.012(0.3)
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ )
Symbols
Zener current see table "Characteristics"
Power dissipation at TA=25℃
Ptot
Junction temperature
TJ
Storage temperature range
T STG
1)Valid provided that at a distance of 8mm from case are kept at ambient temperature
Value
5001)
175
-65 to + 175
Units
mW
℃
℃
ELECTRICAL CHARACTERISTICS(TA=25℃ )
Symbols
Min.
Thermal resistance junction to ambient
R THA
Forward voltage at IF=100mA
VF
1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature
Typ.
Max.
0.3 1)
1
Units
K /mW
V