GBU6005 Datasheet, PDF (1/2 Pages) Diodes Incorporated – 6.0A GLASS PASSIVATED BRIDGE RECTIFIER

GBU6005 THRU GBU610
GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 6.0 Ampere
FEATURES
● Glass passivated chip junction
● Reliable low cost construction utilizing molded
plastic technique
● Ideal for printed circuit board
● Low reverse leakage current
● Low forward voltage drop
● High surge current capabiliy
MECHANICAL DATA
● Case:Molded plastic, GBU
● Terminals: Terminals: Leads solderable per MIL-STD-202
method 208 guaranteed
● Epoxy: UL 94V-0 rate flame retardant
● Mounting Position: Any
.752(19.1)
.720(18.3)
.073(1.85)
.057(1.45)
GBU
.874(22.2)
.860(21.8)
3.2*3.2
CHAMFER
.139(3.53)
.133(3.37)
.154(3.9)
.146(3.7)
.232(5.9)
.224(5.7)
.720(18.29)
.680(17.27)
.050(1.27)
.040(1.02)
.100(2.54)
.085(2.16)
.106(2.7)
.080(2.03) ^.091(2.3)
.065(1.65)
.210 .210 .210
.190 .190 .190
(5.3) (5.3) (5.3)
(4.8) (4.8) (4.8)
.022(.56)
.018(.46)
Dimensions in inches and (milimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
Symbols
GBU
6005
GBU
601
GBU
602
GBU
604
GBU
606
GBU
608
GBU
610
Units
Maximum Recurrent Peak Reverse Voltage
V_RRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage
V_RMS
35
70 140 280 420 560 700 V
Maximum DC Blocking Voltage
V_DC
50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current with
Heatsink at T_C = 100 ^OC
I_(AV)
6.0
A
Peak Forward Surge Current, 8.3 ms Single Half-Sine
-Wave superimposed on rated load (JEDEC Method)
I_FSM
175
A
Maximum Forward Voltage at 3.0 A DC and 25 ^OC
V_F
1.0
V
Maximum Reverse Current at T_A = 25 ^OC
at Rated DC Blocking Voltage T_A = 125 ^OC
I_R
10.0
µA
500
Typical Junction Capacitance ¹⁾
C_J
50
pF
Typical Thermal Resistance ²⁾
R_θJC
2.2
O_C/W
Operating and Storage Temperature Range
T_J,T_S
-55 to +150
O_C
1) _{Measured at 1 MHz and applied reverse voltage of 4 VDC.}
2) _{Thermal resistance from junction to case with device mounted on 300 mm X 300 mm X 1.6 mm Cu plate}
heatsink.