DF2005S Datasheet, PDF (1/2 Pages) HY ELECTRONIC CORP. – SURFACE MOUNT GLASS PASSIVATED BRIDEG RECTIFIERS

DF2005S THRU DF210S
GLASS PASSIVATED BRIDGE RECTIFIERS
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere
FEATURES
● Plastic package used has Underwriters
Laboratory Flammability Classification 94V-0
● Glass passivated chip junction
● High surge overload rating of 50 Amperes peak
● High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
MECHANICAL DATA
● Case: Molded plastic body over passivated junctions
● Terminals: Plated leads solderable per MIL-STD-750
Method 2026
● Mounting Position: Any
● Weight: 0.014 oz., 0.4 g
DF-S
.047(1.2)
.037(0.95)
.335(8.5)
.307(7.8)
.031(0.8)
.023(0.6)
.256(6.5)
.244(6.2)
.063(1.6)
.055(1.4)
.323(8.2)
.315(8.0)
.205(5.2)
.197(5.0)
.406(10.3)
.391(10.0)
.140(0.35)
.008(0.2)
. 134 ( 3.4)
.094(2.4)
1
2
3
4
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Output Current at TA = 40^oC
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum DC Forward Voltage Drop per Bridge
Element at 2.0A DC
Maximum Reverse Current at rated
DC Blocking Voltage per element
I²t Rating for Fusing (t<8.3ms)
@TA = 25^oC
@TA = 125^oC
Typical Junction Capacitance ( Note1)
Typical Thermal Resistance (Note 2)
Operating and Storage Temperature Range
SYMBOL
V RRM
VRMS
V DC
IO
DF2005S DF201S
50
100
35
70
50
100
DF202S
200
140
200
DF204S DF206S
400
600
280
420
400
600
2.0
DF208S
800
560
800
DF210S
1000
700
1000
UNITS
V
V
V
A
I FSM
60
A
VF
IR
I²t
CJ
RθJ A
TJ,TSTG
1.1
10.0
500
10.4
25
40
-55 to + 150
V
µA
A²Sec
pF
0_C/W
0_C
NOTES : 1.Measured at 1 MHZ and applied reverse voltage of 4.0 volts
2. Thermal Resistance from Junction to Ambient and from junction to lead mounted on P.C.B. with 0.5 x 0.5" (13x13mm) copper pads.