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BSS64 Datasheet, PDF (1/2 Pages) NXP Semiconductors – NPN high-voltage transistor
BSS 64
NPN
Switching Transistors
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
NPN
2.9 ±0.1
1.1
0.4
3
Type
Code
1
2
1.9
Dimensions / Maße in mm
1=B 2=E 3=C
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
250 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
B open VCE0
Collector-Base-voltage
E open VCB0
Emitter-Base-voltage
C open VEB0
Power dissipation – Verlustleistung
Ptot
Collector current – Kollektorstrom (dc)
IC
Peak Collector current – Kollektor-Spitzenstrom ICM
Peak Base current – Basis-Spitzenstrom
IBM
Junction temp. – Sperrschichttemperatur
Tj
Storage temperature – Lagerungstemperatur
TS
Grenzwerte (TA = 25/C)
BSS 64
80 V
120 V
5V
250 mW 1)
100 mA
250 mA
100 mA
150/C
- 65…+ 150/C
Characteristics (Tj = 25/C)
Collector-Base cutoff current – Kollektorreststrom
IE = 0, VCB = 90 V
ICB0
IE = 0, VCB = 90 V, Tj = 150/C
ICB0
Emitter-Base cutoff current – Emitterreststrom
IC = 0, VEB = 5 V
IEB0
Collector saturation volt. – Kollektor-Sättigungsspg. 1)
IC = 4 mA, IB = 0.4 mA
IC = 50 mA, IB = 15 mA
VCEsat
VCEsat
Kennwerte (Tj = 25/C)
Min.
Typ.
Max.
–
–
100 nA
–
–
50 :A
–
1 nA 200 nA
–
–
150 mV
–
–
200 mV
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
16
01.11.2003