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BCW89 Datasheet, PDF (1/2 Pages) NXP Semiconductors – PNP general purpose transistor | |||
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BCW 89
PNP
General Purpose Transistors
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
PNP
2.9 ±0.1
1.1
0.4
3
Type
Code
1
2
1.9
Dimensions / MaÃe in mm
1=B 2=E 3=C
Power dissipation â Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. â Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
250 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
B open
Collector-Base-voltage
E open
Emitter-Base-voltage
C open
Power dissipation â Verlustleistung
Collector current â Kollektorstrom (DC)
Peak Collector current â Kollektor-Spitzenstrom
Peak Base current â Basis-Spitzenstrom
Junction temperature â Sperrschichttemperatur
Storage temperature â Lagerungstemperatur
- VCE0
- VCB0
- VEB0
Ptot
- IC
- ICM
- IBM
Tj
TS
Grenzwerte (TA = 25/C)
BCW 89
60 V
80 V
5V
250 mW 1)
100 mA
200 mA
200 mA
150/C
- 65â¦+ 150/C
Characteristics (Tj = 25/C)
Collector-Base cutoff current â Kollektorreststrom
IE = 0, - VCB = 20 V
IE = 0, - VCB = 20 V, Tj = 100/C
Emitter-Base cutoff current â Emitterreststrom
- ICB0
- ICB0
IC = 0, - VEB = 5 V
- IEB0
Collector saturation volt. â Kollektor-Sättigungsspg. 2)
- IC = 10 mA, - IB = 0.5 mA
- IC = 50 mA, - IB = 2.5 mA
- VCEsat
- VCEsat
Kennwerte (Tj = 25/C)
Min.
Typ.
Max.
â
â
100 nA
â
â
10 :A
â
â
100 nA
â
80 mV 300 mV
â
150 mV
â
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem AnschluÃ
2) Tested with pulses tp = 300 :s, duty cycle # 2% â Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
50
01.11.2003
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