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BCV27 Datasheet, PDF (1/2 Pages) NXP Semiconductors – NPN Darlington transistors
BCV27, BCV47
Darlington Transistors
NPN
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
Version 2004-01-20
Power dissipation – Verlustleistung
2.9 ±0.1
1.1
0.4
3
Type
Code
1
2
1.9
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Dimensions / Maße in mm
1 = B1 2 = E2 3 = C
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
NPN
250 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
VBE = 0
VCES
Collector-Base-voltage
E open
VCB0
Emitter-Base-voltage
C open VEB0
Power dissipation – Verlustleistung
Ptot
Collector current – Kollektorstrom (dc)
IC
Peak Collector current – Kollektor-Spitzenstrom ICM
Base current – Basisstrom (dc)
IB
Junction temperature – Sperrschichttemperatur Tj
Storage temperature – Lagerungstemperatur
TS
Grenzwerte (TA = 25/C)
BCV27
BCV47
30 V
60 V
40 V
80 V
10 V
250 mW 1)
500 mA
800 mA
100 mA
150/C
- 65…+ 150/C
Characteristics (Tj = 25/C)
Collector-Base cutoff current – Kollektorreststrom
IE = 0, VCB = 30 V
IE = 0, VCB = 60 V
BCV27 ICB0
BCV47 ICB0
Emitter-Base cutoff current – Emitterreststrom
IC = 0, VEB = 10 V
IEB0
Collector saturation volt. – Kollektor-Sättigungsspg. 2)
IC = 100 mA, IB = 0.1 mA
VCEsat
Kennwerte (Tj = 25/C)
Min.
Typ.
Max.
–
–
100 nA
–
–
100 nA
–
–
100 nA
–
–
1V
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
2) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
8