BC817 Datasheet, PDF (1/2 Pages) NXP Semiconductors – NPN general purpose transistor

BC 817 / BC 818
General Purpose Transistors
NPN
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
NPN
2.9 ^±0.1
1.1
0.4
3
Type
Code
1
2
1.9
Dimensions / Maße in mm
1=B 2=E 3=C
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
310 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (T_A = 25/C)
Collector-Emitter-voltage
B open V_CE0
Collector-Emitter-voltage
B shorted V_CES
Collector-Base-voltage
E open
V_CB0
Emitter-Base-voltage
C open V_EB0
Power dissipation – Verlustleistung
P_tot
Collector current – Kollektorstrom (DC)
I_C
Peak Coll. current – Kollektor-Spitzenstrom
I_CM
Peak Base current – Basis-Spitzenstrom
I_BM
Peak Emitter current – Emitter-Spitzenstrom - I_EM
Junction temperature – Sperrschichttemperatur T_j
Storage temperature – Lagerungstemperatur
T_S
Characteristics, T_j = 25/C
DC current gain – Kollektor-Basis-Stromverhältnis
V_CE = 1 V, I_C = 100 mA
V_CE = 1 V, I_C = 500 mA
V_CE = 1 V, I_C = 100 mA
BC817
h_FE
BC818
h_FE
Group -16 h_FE
Group -25 h_FE
Group -40 h_FE
Grenzwerte (T_A = 25/C)
BC 817
BC 818
45 V
25 V
50 V
30 V
50 V
30 V
5V
310 mW ¹)
800 mA
1000 mA
200 mA
1000 mA
150/C
- 65…+ 150/C
Min.
Kennwerte, T_j = 25/C
Typ.
Max.
100
–
600
40
–
–
100
160
250
160
250
400
250
400
600
1_{) Mounted on P.C. board with 3 mm}2 _{copper pad at each terminal}
Montage auf Leiterplatte mit 3 mm² Kupferbelag (Lötpad) an jedem Anschluß
6
01.11.2003