APX823 Datasheet, PDF (5/12 Pages) Diodes Incorporated – PROCESSOR SUPERVISORY CIRCUITS

APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Electrical Characteristics (Continued)
(Over recommended operating ambient temperature range, unless otherwise noted)
Symbol
Parameter
Test Conditions Min Typ. Max Unit
APX823/APX824/APX825A -23
2.21 2.25 2.30
APX823/APX824/APX825A -26
2.59 2.63 2.69
APX823/APX824/APX825A -29
2.88 2.93 3.00
APX823/APX824/APX825A -31 T_A = 0^oC -85^oC 3.02 3.08 3.15
V
APX823/APX824/APX825A -40
3.93 4.00 4.08
Negative-going ^{APX823/APX824/APX825A -44}
4.31 4.38 4.47
V_TH-
Input Threshold APX823/APX824/APX825A -46
Voltage
APX823/APX824/APX825A -23
4.56 4.63 4.72
2.20 2.25 2.30
(see Note 4) APX823/APX824/APX825A -26
2.57 2.63 2.69
APX823/APX824/APX825A -29
2.86 2.93 3.00
APX823/APX824/APX825A -31 T_A= -40^oC -85^oC 3.00 3.08 3.15
V
APX823/APX824/APX825A -40
3.92 4.00 4.08
V_hys
T_S
I_IH(AV)
I_IL(AV)
I_IH
I_IL
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
Hysteresis at
V_CC Input
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
Set-up Time V_CC = V_TH to (V_TH – 100mV)
Average
High-level Input
WDI=V_CC,
Time average
Current
(dc=88%)
Average
WDI
Low-level Input
Current
WDI=0.3V,
V_CC=5.5V time
average
(dc=12%)
High-level Input
Current
WDI
WDI=V_CC
Low-level Input
Current
WDI
WDI=0.3V,
V_CC=5.5V
4.29 4.38 4.47
4.54 4.63 4.72
-
50
-
mV
-
50
-
20
μs
- 120 -
μA
- -15 -
μA
- 120 160 μA
- 120 160 μA
WDI and MR
I_CC Supply Current _{Unconnected, Outputs}
unconnected
V_CC = V_TH-+0.2V -
30 40
μA
Internal Pull-up Resistor at MR
TC V_OUT Temperature Coefficient
C_{i Input Capacitance at MR , WDI}
θ_JA Thermal Resistance Junction-to-Ambient
θ_JC Thermal Resistance Junction-to-Case
-
60
-
kΩ
50
- ppm/^oC
V_I = 0V to 5.5V
-
5
-
pF
SOT25 (Note 6)
161
SOT26 (Note 6)
169
SOT25 (Note 6)
27
SOT26 (Note 6)
28
o_C/W
o_C/W
Notes: 4. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1μF) should be placed near the supply terminals.
5. The RESET short-circuit current is the maximum pull-up current when RESET is driven low by a P bidirectional reset pin.
6. Test condition for SOT25 and SOT26: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
APX823/APX824/APX825A Rev. 3
5 of 12
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FEBRUARY 2009
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