AP7361_17 Datasheet, PDF (5/22 Pages) Diodes Incorporated – 1A LOW DROPOUT ADJUSTABLE AND FIXED-MODE REGULATOR WITH ENABLE

AP7361
Electrical Characteristics (@TA = +25°C, VIN = VOUT +1V, CIN = 1μF, COUT = 4.7μF, VEN = VIN unless otherwise specified.)
Symbol
VREF
IADJ
IQ
ISHDN
VOUT
ΔVOUT
ΔVIN VOUT
VOUT / VOUT
VDROPOUT
VIL
VIH
IEN
ILIMIT
ISHORT
PSRR
tST
ΔVOUT
ΔT_A  VOUT
TSHDN
THYS
θJA
Parameter
FB Reference Voltage
ADJ Pin Leakage
Input Quiescent Current
Input Shutdown Current
Output Voltage Accuracy
Line Regulation
Load Regulation
Dropout Voltage (Note 7)
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input Leakage
Current Limit
Short-Circuit Current
Power Supply Rejection Ratio
(Note 8)
Start-Up Time
Output Voltage Temperature Coefficient
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Thermal Resistance Junction-to-Ambient
Test Conditions
IOUT = 10mA, TA = +25°C
Enabled, IOUT = 0A
VEN = 0V, IOUT = 0A
IOUT = 100mA, TA = +25°C
IOUT = 100mA, -40°C ≤ TA ≤ +85°C
Over VIN, IOUT, and TA
VIN = VOUT +1V to
6V, IOUT = 100mA
TA = +25°C
-40°C ≤TA ≤ +85°C
IOUT from 1mA to 300mA
IOUT from 1mA to 1A
IOUT = 300mA
IOUT = 500mA
IOUT = 1A
VIN = 6V, VEN = 0V or 6V
VIN = VOUT +1V
VIN = VOUT +1V, Output Voltage < 15% VOUT
f = 1KHz, IOUT = 100mA
f = 10KHz, IOUT = 100mA
VOUT = 3V, COUT = 1µF, RL = 30Ω
IOUT = 100mA, -40°C ≤ TA ≤ +85°C
U-DFN3030-8 (Note 9)
TO252 (Note 9)
SOT223 (Note 9)
SOT89-5 (Note 9)
SO-8EP (Note 9)
Min Typ Max Unit
0.8
V
0.1 0.5 µA
70
90 µA
-1
0.05
1
µA
-1
1
-2
2
%
-3
±0.5
3
0.01 0.1
%/V
0.2
-1.0
0.5
1.0
%
-1.0
0.5
1.0
%
150 200
250 350 mV
500 700
0
0.3
V
1.0
VIN
V
-0.1 0.01 0.1 µA
1.1
1.5
A
200
mA
60
65
dB
45
200
µs
±130
ppm/°C
150
°C
20
°C
70
95
110
°C/W
150
100
Notes:
7. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its
nominal value. This parameter only applies to output voltages above 1.5V since minimum VIN = 2.2V.
8. For VIN  2.5V and VIN = VOUT +1V. For VIN < 2.5V, the PSRR performance may be reduced.
9. Test condition: DFN3030E-8, SO-8EP device mounted on 2"x2", FR-4 substrate PCB, with minimum recommended pad on top layer and thermal vias to
bottom layer ground plane. TO252 device mounted on 2"x2" FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
SOT223 the device is mounted on FR-4 substrate PC board, with minimum recommended pad layout. SOT89-5L device mounted on 1"x1" FR-4
substrate PC board, with minimum recommended pad layout.
AP7361
Document number: DS33626 Rev. 11 - 3
5 of 22
www.diodes.com
March 2017
© Diodes Incorporated