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ZVN4525G Datasheet, PDF (4/8 Pages) Zetex Semiconductors – 250V N-CHANNEL ENHANCEMENT MODE MOSFET
ZVN4525G
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN. TYP.
MAX. UNI CONDITIONS.
T
STATIC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
Static Drain-Source On-State Resistance (1)
V(BR)DSS
IDSS
IGSS
VGS(th)
RDS(on)
250
0.8
Forward Transconductance (3)
DYNAMIC (3)
gfs
0.3
285
35
±1
1.4
5.6
5.9
6.4
0.475
500
±100
1.8
8.5
9.0
9.5
V ID=1mA, VGS=0V
nA VDS=250V, VGS=0V
nA VGS=±40V, VDS=0V
V
I =1mA,
D
VDS=
VGS
Ω VGS=10V, ID=500mA
Ω VGS=4.5V, ID=360mA
Ω VGS=2.4V, ID=20mA
S VDS=10V,ID=0.3A
Input Capacitance
Output Capacitance
Ciss
72
Coss
11
pF
VDS=25 V, VGS=0V,
pF f=1MHz
Reverse Transfer Capacitance
Crss
3.6
pF
SWITCHING(2) (3)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate Drain Charge
SOURCE-DRAIN DIODE
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
1.25
1.70
11.40
3.50
2.6
0.2
0.5
3.65
0.28
0.70
ns
VDD =30V, ID=360mA
ns RG=50Ω, VGS =10V
(refer to test circuit)
ns
ns
nC
VDS=25V,VGS=10V,
nC ID=360mA(refer to
test circuit)
nC
Diode Forward Voltage (1)
VSD
0.97
Reverse Recovery Time (3)
trr
186
260
Reverse Recovery Charge (3)
Qrr
34
48
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
V Tj=25°C, IS=360mA,
VGS=0V
ns Tj=25°C, IF=360mA,
di/dt= 100A/µs
nC
ISSUE 1 - MARCH 2001
4