AP8801_0912 Datasheet, PDF (4/11 Pages) Diodes Incorporated – 500mA LED Step-down Converter

AP8801
500mA LED Step-down Converter
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
V_IN
VSW
T_J
T_LEAD
T_ST
VIN pin voltage
SW voltage
Junction Temperature
Lead Temperature Soldering
Storage Temperature Range
-0.3~50
V
-0.3~50
V
150
o_C
300
o_C
-65 to +150
o_C
Caution:
The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not
be exceeded under any condition.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken
when handling and transporting these devices
Recommended Operating Conditions
Symbol
Parameter
Min
Max
Unit
T_A
Ambient Temperature Range
Duty Cycle Using Inductor ≥ 100µH (Note 3)
-40
105
ºC
0.1
0.95
Notes:
3. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on
propagation delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is
most noticeable at low duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.
Electrical Characteristics (V_IN =24V, T_A=25^oC, unless otherwise specified)
Symbol
Parameter
Conditions
Min Typ. Max Unit
V_IN
I_OUT
I_Q
F_OSC
V_THD
V_REF
SET
Operating Input Voltage
Continuous switch current
Quiescent Current
Switching Frequency
Internal Threshold Voltage
Internal Reference Voltage
SET pin input current
Rds(on) On Resistance of MOSFET
I_{SW Leakage} Switch leakage current
EN Voltage High
EN Voltage Low
θ_JA
Thermal Resistance
Junction-to-Ambient
(Note 4)
V_SET=V_IN-0.2
I_SW=0.4A
ON
OFF
SOP-8L (Note 5)
MSOP-8L (Note 5)
8.0
-
48 V
500 mA
-
78 120 μA
-
-
0.5 MHz
184 200 216 mV
-
1.25
-
V
-
7
-
μA
0.7 1.15 Ω
-
-
8 μA
1.25
-
-
V
-
-
0.2 V
-
88
- °C/W
-
128
- °C/W
θ_JC
Thermal Resistance
Junction-to-Case
SOP-8L (Note 5)
MSOP-8L (Note 5)
-
58
- °C/W
-
90
- °C/W
Notes:
4. Refer to figure 6 for the device derating curve.
5. Test condition for SOP-8L and MSOP-8L: Device mounted on FR-4 PCB, 2”x2”, 2oz copper, minimum recommended pad layout on top layer
and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
AP8801 Rev. 4
DS31765
4 of 11
www.diodes.com
DECEMBER 2009
© Diodes Incorporated