AP7335_1009 Datasheet, PDF (4/17 Pages) Diodes Incorporated – 300mA, Low Quiescent Current, Fast Transient

AP7335
300mA, Low Quiescent Current, Fast Transient
Low Dropout Linear Regulator
Electrical Characteristics
(T_A = 25^oC, V_IN = V_OUT +1V, C_IN = 1μF, C_OUT = 1μF, V_EN = 2V, unless otherwise stated)
Symbol
Parameter
Test Conditions
Min Typ. Max Unit
V_REF
I_ADJ
V_OUT
ΔV_OUT
/ΔV_IN/V
ΔV_OUT
/V_OUT
V_Dropout
I_Q
I_SHDN
I_LEAK
t_ST
ADJ Reference Voltage (Adjustable version)
ADJ Leakage (Adjustable version)
Output Voltage Accuracy
Line Regulation
Load Regulation
Dropout Voltage (Note 3)
Input Quiescent Current
Input Shutdown Current
Input Leakage Current
Start-up Time
PSRR PSRR (Note 4)
I_SHORT Short-circuit Current
I_LIMIT
V_IL
V_IH
I_EN
T_SHDN
T_HYS
θ_JA
Current limit
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input Current
Thermal shutdown threshold
Thermal shutdown hysteresis
Thermal Resistance Junction-to-Ambient
I_OUT= 0mA
0.8
V
T_A = -40^oC to 85^oC,
I_OUT = 10% of I_OUT-Max
V_IN = (V_OUT +1V) to V_IN-Max,
V_EN = V_IN, I_OUT = 1mA
0.1 1 μA
-2
2%
0.02 0.20 %/V
V_IN = (V_OUT +1V) to V_IN-Max,
I_OUT = 1mA to 300mA
-0.6
0.6 %
V_OUT < 2.5V, I_OUT = 300mA
V_OUT ≥ 2.5V, I_OUT = 300mA
170
150
300
200
mV
V_EN = V_IN, I_OUT = 0mA
35 80 μA
V_EN = 0V, I_OUT = 0mA
0.1 1 μA
V_EN = 0V, OUT grounded
0.1 1 μA
V_EN = 0V to 2.0V in 1μs,
I_OUT = 300mA
220
μs
V_IN = [V_OUT +1V]V_DC + 0.5V_ppAC, f =
1kHz, I_OUT = 50mA
65
dB
V_IN = V_IN-Min to V_IN-Max,
V_OUT < 0.2V (fixed) or
25% of V_OUT (ADJ version)
140
mA
V_IN = V_IN-Min to V_IN-Max,
V_OUT/R_OUT = 1.2A
400 600
mA
V_IN = V_IN-Min to V_IN-Max
0.4 V
V_IN = V_IN-Min to V_IN-Max
1.4
V
V_IN = 0V or V_IN-Max
-1
1 μA
145
°C
15
°C
SOT25 (Note 5)
DFN2020-6 (Note 5)
187
251
o_C/W
Notes:
3. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal
value. This parameter only applies to input voltages above minimum V_IN = 2.0V.
4. At V_IN < 2.3V, the PSRR performance may be reduced.
5. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad
layout.
AP7335
Document number: DS32259 Rev. 2 - 2
4 of 17
www.diodes.com
September 2010
© Diodes Incorporated