MBRM360 Datasheet, PDF (3/3 Pages) Diodes Incorporated – 3A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER POWERMITE3

4
3.5
Note 2
3
2.5
Note 3
2
1.5
Note 4
4
T_j = 125°C
Note 5
3
2
1
1
Note 6
0.5
Notes:
0
25
50
75
100
125
150
T_A, AMBIENT TEMPERATURE (°C)
Fig. 5 DC Forward Current Derating
0
0
1
234
567
I_F(AV), AVERAGE FORWARD CURRENT (A)
Fig. 6 Forward Power Dissipation
2. TA = TSOLDERING POINT, RqJS = 3.2°C/W, RqSA = 0°C/W.
3. Device mounted on GETEK substrate, 2”x2”, 2 oz. copper, double-sided, cathode pad dimensions 0.75” x 1.0”, anode pad
dimensions 0.25” x 1.0”. R_qJA in range of 20-40°C/W.
4. Device mounted on FR-4 substrate, 2”x2”, 2 oz. copper, single-sided, pad layout as per Diodes Inc. suggested pad layout
document AP02001 which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. R_qJA in range of
100-120°C/W.
5. Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 3.
6. Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 4.
Ordering Information ^{(Note 7)}
Device
MBRM360-13
Packaging
POWERMITEâ3
Notes: 7. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Shipping
5000/Tape & Reel
Marking Information
MBRM360
YYWW
MBRM360 = Product type marking code
= Manufacturers’ code marking
YYWW = Date code marking
YY = Last digit of year ex: 2 for 2002
WW = Week code 01 to 52
POWERMITE is a registered trademark of Microsemi Corporation.
DS30355 Rev. 2 - 2
3 of 3
MBRM360