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74AUP2G126 Datasheet, PDF (3/11 Pages) NXP Semiconductors – Low-power dual buffer/line driver
74AUP2G126
Absolute Maximum Ratings (Notes 6, 7)
Symbol
ESD HBM
ESD CDM
VCC
VI
VO
IIK
IOK
IO
ICC
IGND
TJ
TSTG
Description
Human Body Model ESD Protection
Charged Device Model ESD Protection
Supply Voltage Range
Input Voltage Range
Voltage Applied to Output in High or Low State
Input Clamp Current (VI < 0)
Output Clamp Current (VO < 0)
Continuous Output Current (VO = 0 to VCC)
Continuous Current Through VCC
Continuous Current Through GND
Operating Junction Temperature
Storage Temperature
Rating
Unit
2
kV
1
kV
-0.5 to +4.6
V
-0.5 to +4.6
V
-0.5 to VCC+0.5
V
50
mA
50
mA
±20
mA
50
mA
-50
mA
-40 to +150
°C
-65 to +150
°C
Notes:
6. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device operation should be
within recommend values.
7. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could cause
a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range.
Recommended Operating Conditions (Note 8)
Symbol
Parameter
VCC
Operating Voltage
VI
VO
IOH
IOL
Δt/ΔV
TA
Input Voltage
Output Voltage
High-Level Output Current
Low-Level Output Current
Input Transition Rise or Fall Rate
Operating Free-Air Temperature
VCC = 0.8V
VCC = 1.1V
VCC = 1.4V
VCC = 1.65V
VCC = 2.3V
VCC = 3.0V
VCC = 0.8V
VCC = 1.1V
VCC = 1.4V
VCC = 1.65V
VCC = 2.3V
VCC = 3.0V
VCC = 0.8V to 3.6V
Note: 8. Unused inputs should be held at VCC or Ground.
Min
Max
Unit
0.8
3.6
V
0
3.6
V
0
VCC
V
—
-20
µA
—
-1.1
—
-1.7
—
-1.9
mA
—
-3.1
—
-4
—
20
µA
—
1.1
—
1.7
—
1.9
mA
—
3.1
—
4
—
200
ns/V
-40
+125
°C
74AUP2G126
Document number: DS36145 Rev. 1 - 2
3 of 11
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January 2015
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