English
Language : 

ZXTEM322 Datasheet, PDF (2/6 Pages) Zetex Semiconductors – MPPS Miniature Package Power Solutions 80V NPN LOW SATURATION TRANSISTOR
OBSOLETE - PLEASE USE ZXTN620MA
ZXTEM322
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current (a)
Base Current
Power Dissipation at TA=25°C (a)
Linear Derating Factor
Power Dissipation at TA=25°C (b)
Linear Derating Factor
Power Dissipation at TA=25°C (d)
Linear Derating Factor
Power Dissipation at TA=25°C (e)
Linear Derating Factor
Operating & Storage Temperature Range
Junction Temperature
SYMBOL
VCBO
VCEO
VEBO
ICM
IC
IB
PD
PD
PD
PD
Tj:Tstg
Tj
LIMIT
100
80
7.5
5
3.5
1000
1.5
12
2.45
19.6
1
8
3
24
-55 to +150
150
UNIT
V
V
V
A
A
mA
W
mW/ЊC
W
mW/ЊC
W
mW/ЊC
W
mW/ЊC
ЊC
ЊC
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a)
Junction to Ambient (b)
Junction to Ambient (d)
Junction to Ambient (e)
R⍜JA
R⍜JA
R⍜JA
R⍜JA
83
ЊC/W
51
ЊC/W
125
ЊC/W
42
ЊC/W
NOTES
(a) For a single device surface mounted on 10 sq cm 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached.
(b) For a single device surface mounted on 10 sq cm 1oz copper on FR4 PCB, in still air conditions measured at tՅ5 secs with all exposed pads
attached.
(c) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.
(d) For a single device surface mounted on 10 sq cm 1oz copper FR4 PCB, in still air conditions with minimal lead connections only.
(e) For a single device surface mounted on 65 sq cm 2oz copper FR4 PCB, in still air conditions with all exposed pads attached.
(f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in
the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and
1mm wide tracks is Rth= 300°C/W giving a power rating of Ptot=420mW
SEMICONDUCTORS
2
ISSUE 2 - JUNE 2006