GDZ8V2BLP3_15 Datasheet, PDF (2/4 Pages) Diodes Incorporated – ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE

GDZ8V2BLP3
Thermal Characteristics
Characteristic
Power Dissipation (Note 5) T_A = 25°C
Thermal Resistance, Junction to Ambient Air (Note 5) T_A = 25°C
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
250
500
-55 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Type
Number
GDZ8V2BLP3
Marking
Code
KI, KR
Nom (V)
8.2
Zener Voltage Range
(Note 6)
V_Z @ I_ZT
Min (V)
7.995
Max (V)
8.405
Maximum
Reverse
Current
(Note 6)
I_ZT
I_R
@ V_R
mA
μA
V
5
0.5
5.0
Notes:
5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0.30
0.25
Note 5
0.20
0.15
0.10
0.05
0
0
10
25
50
75 100 125 150
T_A, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
1
1,000
100
10
1
0.1
0.01
0.2
0.4
0.6
0.8
1.0
1.2
V_F, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
20
f = 1MHz
15
0.1
10
0.01
5
0.001
0
7.0 7.5 8.0 8.5 9.0 9.5 10
0
V_Z, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
GDZ8V2BLP3
Document number: DS35772 Rev. 1 - 2
2 of 4
www.diodes.com
1
2
3
4
5
V_R, REVERSE VOLTAGE (V)
Fig. 4 Typical Total Capacitance
February 2012
© Diodes Incorporated