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DRTR5V0U2SR Datasheet, PDF (2/4 Pages) Diodes Incorporated – 2 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
DRTR5V0U2SR
Maximum Ratings (@TA = +25°C, unless otherwise specified)
Characteristic
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Symbol
IPP
VESD_Contact
VESD_Air
Value
5
±8
±15
Unit
Conditions
A
8/20µs, Per Figure 3
kV
Standard IEC 61000-4-2
kV
Standard IEC 61000-4-2
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
400
310
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Channel Leakage Current (Note 6, 7)
Reverse breakdown voltage
Forward Voltage (Note 7)
Dynamic Resistance (Note 7)
I/O to GND Capacitance (Note 7)
Symbol
Min
Typ
Max
Unit
Test Conditions
VRWM
—
—
5.5
V
—
IR
—
1
100
nA VR = 3V
VBR
6.0
—
9.0
V
IR = 1mA, from pin 4 to pin 1
VF
—
0.8
—
RDYN
—
0.9
—
V
IF = 8mA
Ω
IPP = 1A, tp = 8/20μs
C(I/O-GND)
—
1.0
1.5
pF
V(I/O-GND) = 0V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Measured from pin 2 or pin 3 to GND.
8. For information on the impact of Diodes' USB 2.0 compatible ESD protectors on signal integrity including eye diagram plots, please refer to AN77 at the
following URL: http://www.diodes.com/destools/appnote_dnote.html.
400
350
Note 5
300
250
200
150
100
50
0
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 1 Power Dissipation vs. Ambient Temperature
100
75
50
25
0
0 25 50 75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Figure 2 Pulse Derating Curve
DRTR5V0U2SR
Document number: DS36005 Rev. 3 - 2
2 of 4
www.diodes.com
August 2013
© Diodes Incorporated