DFLU1200_15 Datasheet, PDF (2/5 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT SUPER-FAST RECTIFIER PowerDI®123

Maximum Ratings (@T_A = +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 3)
RMS Reverse Voltage
Average Rectified Output Current (see figure 4)
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_O
DFLU1200
Value
Unit
200
V
140
V
1.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance Junction to Soldering Point (Note 6)
Thermal Resistance Junction to Ambient (Note 5)
Thermal Resistance Junction to Ambient (Note 7)
Operating and Storage Temperature Range
@ T_A = +25°C
@T_A = +25°C
@T_A = +25°C
Symbol
P_D
R_JS
R_JA
R_JA
T_J, T_STG
Typ
Max

1.0

6
116

182

-65 to +150
Unit
W
°C/W
°C/W
°C/W
°C
Electrical Characteristics (@T_A = +25°C, unless otherwise specified.)
Characteristic
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Forward Voltage Drop
Peak Reverse Current
at Rated DC Blocking Voltage (Note 4)
Reverse Recovery Time (Note 8)
@ I_F = 0.6A
@ I_F = 1.0A
@ T_A = +25C
@ T_A = +100C
Typical Total Capacitance (f = 1MHz, V_R = 4VDC)
Symbol
I_FSM
V_FM
I_RM
t_rr
C_T
Value
30
0.90
0.98
5.0
200
25
27
Notes:
4. Short duration pulse test used to minimize self-heating effect.
5. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
6. Theoretical R_JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
7. Device mounted on FR-4 PCB, 2 oz. Copper, minimum recommended pad layout pattern per http://www.diodes.com/datasheets/ap02001.pdf
8. Measured with I_F = 0.5A, I_R = 1.0A, I_rr = 0.25A. See figure 7.
Unit
A
V
µA
ns
pF
DFLU1200
Document number: DS30601 Rev. 4 - 2
2 of 5
www.diodes.com
June 2013
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