US1A_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

SPICE MODELS: US1A US1B US1D US1G US1J US1K US1M
US1A - US1M
1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
Features
· Glass Passivated Die Construction
· Ultra-Fast Recovery Time for High Efficiency
· Surge Overload Rating to 30A Peak
· High Current Capability
· Ideally Suited for Automated Assembly
· Lead Free Finish/RoHS Compliant (Note 4)
Mechanical Data
· Case: SMA
· Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208 e3
· Polarity: Cathode Band or Cathode Notch
· Marking: Type Number & Date Code: See Page 3
· Ordering Information: See Page 3
· Weight: 0.064 grams (approximate)
B
A
J
H
G
E
SMA
Dim Min Max
A
2.29 2.92
C
B
4.00 4.60
C
1.27 1.63
D
0.15 0.31
D
E
4.80 5.59
G
0.10 0.20
H
0.76 1.52
J
2.01 2.62
All Dimensions in mm
Maximum Ratings and Electrical Characteristics ^TA ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
V_RRM
V_RWM
VR
RMS Reverse Voltage
V_R(RMS)
Average Rectified Output Current
@ T_T = 75°C
IO
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
Forward Voltage Drop
@ I_F = 1.0A V_FM
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ T_A = 25°C
@ T_A = 100°C
IRM
Reverse Recovery Time (Note 2)
t_rr
Typical Total Capacitance (Note 1)
C_T
Typical Thermal Resistance, Junction to Terminal
RqJT
Operating and Storage Temperature Range
T_j, T_STG
US1A
50
35
US1B US1D US1G US1J
100 200 400 600
70
140 280 420
1.0
30
1.0
50
20
1.3
5.0
100
30
-65 to +150
US1K
800
560
1.7
75
10
US1M Unit
1000 V
700 V
A
A
V
mA
ns
pF
°C/W
°C
Notes:
1. Measured with I_F = 0.5A, I_R = 1.0A, I_rr = 0.25A. See figure 5.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Unit mounted on PC board with 5.0 mm² (0.013 mm thick) copper pad as heat sink.
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
5. Short duration pulse test used to minimize self-heating effect.
DS16008 Rev. 7 - 2
1 of 3
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