SDM40E20LS Datasheet, PDF (1/3 Pages) Diodes Incorporated – DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE

SDM40E20LS
DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
· Very Low Forward Voltage Drop
· Guard Ring Construction for
Transient Protection
· High Conductance
A
Mechanical Data
BC
· Case: SOT-23, Plastic
· Case material - UL Flammability Rating
Classification 94V-0
TOP VIEW
E
D
G
· Moisture sensitivity: Level 1 per J-STD-020A
H
· Polarity: See Diagram
· Leads: Solderable per MIL-STD-202,
Method 208
K
M
J
L
· Marking: Date Code and Type Code
· Type Code: KSW
Weight: 0.004 grams (approx.)
· Ordering Information: See Page 3
SOT-23
Dim Min Max
A
0.37 0.51
B
1.20 1.40
C
2.30 2.50
D
0.89 1.03
E
0.45 0.60
G
1.78 2.05
H
2.80 3.00
J 0.013 0.10
K 0.903 1.10
L
0.45 0.61
M
0.85 0.80
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current
8.3ms single half sine-wave superimposed on rated load
(JEDEC Method)
Power Dissipation (Note 1)
Typical Thermal Resistance Junction to Ambient (Note 1)
Power Dissipation (Note 2)
Typical Thermal Resistance Junction to Ambient (Note 2)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VR
V_R(RMS)
I_FM
IFSM
P_d
RqJA
Pd
RqJA
Tj, TSTG
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
SDM40E20LS
20
14
0.4
2
225
444
300
333
-55 to +125
Unit
V
V
A
A
mW
°C/W
mW
°C/W
°C
Characteristic
Reverse Breakdown Voltage (Note 3)
Forward Voltage Drop (Note 3)
Leakage Current (Note 3)
Total Capacitance
Symbol
Min
Typ Max
Unit
V(BR)R
20
¾
¾
V
VF
¾
¾
¾ 0.310
¾ 0.430
V
I_R
¾
¾
¾
100
¾
250
mA
C_T
¾
170
¾
pF
Test Conditions
IR = 0.5mA
I_F = 0.1A
IF = 0.5A
V_R = 10V
VR = 20V
f = 1MHz, V_r = 0VDC
Notes:
1. Device mounted on FR-5 1.0 x 0.75 x 0.062 inch PCB pad layout as shown on Diodes Inc. suggested pad layout AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration test pulse used to minimize self-heating effect.
DS30298 Rev. 2 - 2
1 of 3
SDM40E20LS