SDM10M45SD_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

SPICE MODELS: SDM10M45SD
Lead-free Green
SDM10M45SD
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
· Fast Switching Speed
· Ultra-Small Surface Mount Package
· For General Purpose Switching Applications
· High Conductance
· Lead Free/RoHS Compliant (Note 4)
· "Green" Device (Note 5 and 6)
Mechanical Data
· Case: SOT-26
· Case Material: Molded Plastic, "Green" Molding
Compound, Note 6. UL Flammability Classification 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Solderable per MIL-STD-202, Method 208
· Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
· Polarity: See Diagram
· Marking: KLG, See Page 2
· Ordering Information: See Below
· Weight: 0.016 grams (approximate)
A
TOP VIEW ^{B C}
H
K
J
DF
L
SOT-26
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D ¾ ¾ 0.95
F ¾ ¾ 0.55
M
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
a 0° 8° ¾
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Forward Surge Current
@ t < 8.3ms
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_FM
IFSM
P_d
R_qJA
T_j , T_STG
Value
45
40
100
1.0
225
444
-40 to +125
Unit
V
V
mA
A
mW
°C/W
°C
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance
Ordering Information (Note 3 & 6)
Symbol Min
V_(BR)R
45
V_F
¾
I_R
¾
CT
¾
Typ
¾
370
0.07
6.0
Max
¾
450
1.0
¾
Unit
Test Condition
¾ IR = 100mA
mV IF = 10mA
mA VR = 10V
pF VR = 10V, f = 1.0MHz
Device
SDM10M45SD-7-F
Packaging
SOT-26
Shipping
3000/Tape & Reel
Note:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test to minimize self-heating effect.
3. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30386 Rev. 4 - 2
1 of 3
www.diodes.com
SDM10M45SD
ã Diodes Incorporated