SDM10K45_15 Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

SDM10K45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• High Conductance
• Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOD-323
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating).Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
V_RRM
Working Peak Reverse Voltage
V_RWM
45
V
DC Blocking Voltage
V_R
RMS Reverse Voltage
V_R(RMS)
40
V
Forward Continuous Current (Note 1)
I_FM
100
mA
Forward Surge Current
@ t < 8.3ms
I_FSM
1.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range (Note 5)
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
500
-40 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance
Symbol Min
V_(BR)R
45
V_F
⎯
I_R
⎯
C_T
⎯
Typ
⎯
370
0.07
6.0
Max
⎯
450
1.0
⎯
Unit
⎯
mV
μA
pF
Test Condition
I_R = 100μA
I_F = 10mA
V_R = 10V
V_R = 10V, f = 1.0MHz
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dP_D/dT_J < 1/R_θJA
SDM10K45
Document number: DS30256 Rev. 15 - 2
1 of 4
www.diodes.com
June 2010
© Diodes Incorporated