SDM03MT40_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features
• Low Forward Voltage Drop
• Guard Ring Die Construction for Transient Protection
• Ideal for low logic level applications
• Low Capacitance
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device, Note 4 and 5
SDM03MT40/A
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity: See Diagram
• Leads: Matte Tin (Lead Free), Solderable per MIL-STD-202,
Method 208
• Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.016 grams (approximate)
Top View
SDM03MT40
Device Schematic
SDM03MT40A
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 2)
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load
(JEDEDC method)
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_FM
I_FSM
Value
40
28
30
200
Unit
V
V
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
225
444
-40 to +125
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 1)
Forward Voltage Drop (Note 1)
Leakage Current (Note 1)
Total Capacitance
Symbol Min
Typ
Max
Unit
Test Condition
V_(BR)R
40
⎯
⎯
V I_{R =} 10uA
V_F
⎯
⎯
370
mV I_F = 1mA
I_R
⎯
⎯
1
μA V_R = 10V
C_T
⎯
2
⎯
pF V_R = 1V f = 1.0 MHz
Notes:
1. Short duration pulse test used to minimize self-heating effect.
2. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
SDM03MT40/A
Document number: DS30372 Rev. 11 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated