SDA006_15 Datasheet, PDF (1/4 Pages) Diodes Incorporated – DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER

SDA006
DATA BUS TRANSIENT SUPPRESSOR / 3-PHASE FULL WAVE BRIDGE RECTIFIER
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Features
Mechanical Data
• Fast Switching Speed
•
• Ultra-Small Surface Mount Package
•
• For 3-Phase Full Wave Bridge Rectification, or 3 Dataline Rail
Clamp
•
• Lead Free By Design/RoHS Compliant (Note 3)
•
• "Green" Device (Note 4)
•
IEC Compatibility (Note 5)
•
• 61000-4-2 (ESD) Air-10kV Contact-8kV
•
• 61000-4-5 (Surge) 8x20μs, 14.5 Amperes
SOT-363
Case: SOT-363
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 4)
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
Leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
/ / / ^{AC3 DC+ DC+}
DL₃ V_CC V_CC
TOP VIEW
/ / / ^{DL1 GND DL2}
AC₁ DC- AC2
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
V_RM
100
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
75
V
V_R
RMS Reverse Voltage
V_R(RMS)
53
V
Forward Continuous Current (Note 1)
I_FM
215
mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
2.0
@ t = 1.0ms
I_FSM
1.0
A
@ t = 1.0s
0.5
Clamping Voltage (Note 6) @ Ipp = 14.5A
8x20μs Waveform
V_C
16
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient Air (Note 1)
Thermal Resistance Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range
Symbol
P_D
P_D
R_θJA
R_θJA
T_J , T_STG
Value
200
300
625
417
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Tested with V_CC connected to Ground to simulate appropriate V_CC decoupling to Ground.
6. Reference to V_CC or Ground.
SDA006
Document number: DS30559 Rev. 6 - 2
1 of 4
www.diodes.com
April 2008
© Diodes Incorporated