SD107WS_15 Datasheet, PDF (1/4 Pages) SeCoS Halbleitertechnologie GmbH – Plastic-Encapsulate Schottky Diodes

Features
• Low Forward Voltage Drop
• Guard Ring Die Construction for Transient Protection
• Ideal for low logic level applications
• Low Capacitance
• Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)
• "Green" Device (Note 4)
SD107WS
SURFACE MOUNT SCHOTTKY BARRIER DIODE
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Mechanical Data
• Case: SOD-323
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Leads: Matte Tin Finish annealed over Alloy 42 leadframe (Lead
Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.004 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
30
V
V_R
RMS Reverse Voltage
V_R(RMS)
21
V
Forward Continuous Current (Note 1)
I_FM
100
mA
Non-Repetitive Peak Forward Surge Current @ t ≤ 10ms
I_FSM
750
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
250
500
-65 to 150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage Drop
Peak Reverse Current (Note 2)
Total Capacitance
Symbol Min
Typ
Max
Unit
Test Condition
V_(BR)R
30
⎯
⎯
V I_{R =} 100μA
300
⎯
@ I_F = 2.0mA
V_FM
⎯
360
470
⎯
550
mV ^{@ IF = 15mA}
@ I_F = 50mA
580
800
@ I_F = 100mA
I_RM
⎯
⎯
1.0
μA V_R = 25V
C_T
⎯
7
⎯
pF V_R = 10V f = 1.0 MHz
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
SD107WS
Document number: DS30129 Rev. 10 - 2
1 of 4
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December 2009
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