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SD103ASDM_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
• Low Forward Voltage Drop
• Guard Ring Construction for Transient Protection
• Fast Switching
• Low Reverse Capacitance
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device, (Note 4 and 5)
SD103ASDM
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
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Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity: See Diagram
• Leads: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.016 grams (approximate)
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current
@ t ≤ 1.0s
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFSM
Value
40
28
350
1.5
Unit
V
V
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
225
444
-65 to +125
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage Drop
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min Typ Max Unit
Test Condition
V(BR)R
40
⎯
⎯
V IR = 100μA
0.37
IF = 20mA
VF
⎯
⎯
0.50
V IF = 100mA
0.60
IF = 200mA
IR
⎯
⎯
5.0
μA VR = 30V
CT
⎯
50
⎯
pF VR = 0V, f = 1.0MHz
trr
⎯
10
⎯
ns IF = IR = 200mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
SD103ASDM
Document number: DS30294 Rev. 9 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated