SD103ASDM_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY

SPICE MODELS: SD103ASDM
Lead-free Green
SD103ASDM
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
· Low Forward Voltage Drop
· Guard Ring Construction for Transient Protection
· Fast Switching
· Low Reverse Capacitance
· Lead Free/RoHS Compliant (Note 3)
· "Green" Device, Note 4 and 5
A
TOP VIEW ^{B C}
Mechanical Data
H
K
· Case: SOT-26
· Case Material: Molded Plastic, "Green" Molding Compound, ^J
Note 5. UL Flammability Classification Rating 94V-0
DF
L
· Moisture Sensitivity: Level 1 per J-STD-020C
· Polarity: See Diagram
· Leads: Solderable per MIL-STD-202, Method 208
· Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
· Marking: KSU (See Page 3)
TOP VIEW
· Weight: 0.016 grams (approximate)
SOT-26
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D ¾ ¾ 0.95
F ¾ ¾ 0.55
M
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
a 0° 8° ¾
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t £ 1.0s
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
V_RRM
VRWM
VR
V_R(RMS)
I_FM
I_FSM
P_d
R_qJA
T_j, T_STG
Value
40
28
350
1.5
225
444
-65 to +125
Unit
V
V
mA
A
mW
°C/W
°C
Electrical Characteristics ^{@ TA = 25°C unless otherwise specified}
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage Drop
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min
Typ
Max Unit
Test Condition
V_(BR)R
40
¾
¾
V
I_R = 100mA
0.37
IF = 20mA
V_F
¾
¾
0.50
V
I_F = 100mA
0.60
I_F = 200mA
I_R
¾
¾
5.0
mA VR = 30V
C_T
¾
50
¾
pF VR = 0V, f = 1.0MHz
t_rr
¾
10
¾
ns
IF = IR = 200mA,
I_rr = 0.1 x I_R, R_L = 100W
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
DS30294 Rev. 7 - 2
1 of 3
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