SBR3M30P1 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 3.0A SBR Surface Mount Super Barrier Rectifier

Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Superior Reverse Avalanche Capability
• Patented Interlocking Clip Design for
High Surge Current Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability
SBR3M30P1
3.0A SBR^®
Surface Mount Super Barrier Rectifier
PowerDI™123
Mechanical Data
• Case: PowerDI™123
• Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Polarity Indicator: Cathode Band
• Terminals: Matte Tin Finish annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
Maximum Ratings @ T_A = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Non-Repetitive Avalanche Energy
(T_J = 25°C, I_AS = 5A, L = 8.5 mH)
Repetitive Peak Avalanche Energy
(1µs, 25°C)
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
V_RRM
V_RWM
V_RM
V_R(RMS)
I_O
I_FSM
E_AS
P_ARM
R_Ó¨JS
R_Ó¨JA
T_J, T_STG
Value
30
21
3.0
75
105
1100
5
183
125
-65 to +175
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R_Ó¨JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
Unit
V
V
A
A
mJ
W
°C/W
ºC
__________
SBR is a registered trademark of Diodes Incorporated.
PowerDI is a trademark of Diodes Incorporated.
SBR3M30P1 Rev. 4 - 2
1 of 4
www.diodes.com
January 2007
© Diodes Incorporated