SBR2M30P1_15 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 2.0A SBR® SURFACE MOUNT SUPER BARRIER RECTIFIER PowerDI®123

Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Superior Reverse Avalanche Capability
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability
SBR2M30P1
2.0A SBR^®
SURFACE MOUNT SUPER BARRIER RECTIFIER
PowerDI^®123
Mechanical Data
• Case: PowerDI^®123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity Indicator: Cathode Band
• Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.018 grams (approximate)
Top View
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Non-Repetitive Avalanche Energy
(T_J = 25°C, I_AS = 5A, L = 8.5 mH)
Repetitive Peak Avalanche Energy
(1µs, 25°C)
Symbol
V_RRM
V_RWM
V_RM
V_R(RMS)
I_O
I_FSM
E_AS
P_ARM
Value
30
21
2.0
75
105
1100
Thermal Characteristics
Characteristic
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
R_θJS
R_θJA
R_θJA
T_J, T_STG
Value
5
183
125
-65 to +175
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R_Ó¨JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
Unit
V
V
A
A
mJ
W
Unit
ºC/W
ºC
SBR and PowerDI are registered trademarks of Diodes Incorporated.
SBR2M30P1
Document number: DS30704 Rev. 7 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated