SBR2A40P1 Datasheet, PDF (1/4 Pages) Diodes Incorporated – 2.0A SBR Surface Mount Super Barrier Rectifier

SPICE MODEL: SBR2A40P1
Features
• Low Forward Voltage Drop
• Low Leakage Current
• Superior Reverse Avalanche Capability
• Excellent High Temperature Stability
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 150ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability
SBR2A40P1
2.0A SBR^®
Surface Mount Super Barrier Rectifier
PowerDI™123
Mechanical Data
• Case: PowerDI™123
• Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Polarity Indicator: Cathode Band
• Terminals: Finish - Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
Maximum Ratings @ T_A = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Peak Repetitive Reverse Voltage
V_RRM
Working Peak Reverse Voltage
V_RWM
40
DC Blocking Voltage
V_RM
RMS Reverse Voltage
V_R(RMS)
28
Average Rectified Output Current (See Figure 1)
I_O
2.0
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I_FSM
50
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
R_Ó¨JS
R_Ó¨JA
R_Ó¨jA
5
180
115
Operating and Storage Temperature Range
T_J, T_STG
-65 to +150
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R_Ó¨JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Unit
V
V
A
A
°C/W
ºC
__________
SBR is a registered trademark of Diodes Incorporated.
PowerDI is a trademark of Diodes Incorporated.
SBR2A40P1 Rev. 5 - 2
1 of 4
www.diodes.com
January 2007
© Diodes Incorporated