SBR02M30LP Datasheet, PDF (1/4 Pages) Diodes Incorporated – Super Barrier Rectifier

Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
SBR02M30LP
0.2A SBR^®
Super Barrier Rectifier
Mechanical Data
• Case: DFN1006-2
• Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Polarity Indicator: Cathode Dot
• Terminals: Finish - NiPdAu annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.001 grams (Approx.)
Maximum Ratings @ T_A = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Operating and Storage Temperature Range
Symbol
V_RRM
V_RWM
V_RM
V_R(RMS)
I_O
I_FSM
R_Ó¨JS
R_Ó¨JA
T_J, T_STG
Value
30
21
0.2
5.0
18
263
-65 to +175
Unit
V
V
A
A
ºC/W
ºC
Electrical Characteristics @ T_A = 25ºC unless otherwise specified
Characteristic
Symbol
Min
Reverse Breakdown Voltage (Note 4)
V_(BR)R
30
Forward Voltage Drop
V_F
-
Leakage Current (Note 4)
I_R
-
Typ
-
0.50
0.42
0.57
0.51
0.1
46
Max
-
0.54
0.45
0.61
0.54
0.5
150
Unit
V
V
µA
Test Condition
I_R = 400 µA
I_F = 0.1A, T_J = 25ºC
I_F = 0.1A, T_J = 150ºC
I_F = 0.2A, T_J = 25ºC
I_F = 0.2A, T_J = 150ºC
V_R = 30V, T_J = 25ºC
V_R = 30V, T_J = 150ºC
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R_Ó¨JS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
_________
SBR is a registered trademark of Diodes Incorporated.
SBR02M30LP Rev. 3 - 2
1 of 4
www.diodes.com
May 2007
© Diodes Incorporated