S8KC Datasheet, PDF (1/4 Pages) Diodes Incorporated – 8.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER

Features
• Glass Passivated Die Construction
• Low Forward Voltage Drop and High Current Capability
• Surge Overload Rating to 200A Peak
• Ideally Suited for Automated Assembly
• Lead Free Finish/RoHS Compliant (Note 1)
• Green Molding Compound (No Halogen and Antimony)
(Note 2)
Green
S8KC - S8MC
8.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
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Mechanical Data
• Case: SMC
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
• Polarity: Cathode Band or Cathode Notch
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.21 grams (approximate)
Top View
Bottom View
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
S8KC
S8MC
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
800
V_R
1000
V
RMS Reverse Voltage
V_R(RMS)
560
700
V
Average Rectified Output Current
@ T_T = 75°C
I_O
8.0
A
Non-Repetitive Peak Forward Surge Current, 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I_FSM
200
A
Thermal Characteristics
Characteristic
Typical Thermal Resistance, Junction to Terminal (Note 4)
Operating and Storage Temperature Range
Symbol
R_θJT
T_J, T_STG
Value
10
-65 to +150
Unit
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Forward Voltage
Peak Reverse Current
Typical Total Capacitance (Note 3)
@ I_F = 8.0A
@T_A = 25°C
@T_A = 125°C
Symbol
V_FM
I_RM
C_T
Value
0.985
10
250
40
Unit
V
μA
pF
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/quality/lead_free.html.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
4. Thermal resistance junction to terminal, device mounted on 100.5mm x 102.5mm x 1.7mm Cu plate heatsink.
S8KC - S8MC
Document number: DS31117 Rev. 7 - 2
1 of 4
www.diodes.com
July 2009
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